High‑quality thermal pad engineered to enhance heat dissipation across a wide range of components including VRMs, memory and chipsets. The 120×20 mm strip offers flexibility and can be cut to size, while the 1.0 mm thickness suits moderate spacing. Its strong thermal conductivity and soft texture ensure clean, reliable installation. Known for dependable performance, it supports long‑term cooling stability. Improve thermal coverage—upgrade with trusted thermal padding today.